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Press ReleasesMonday, January 17, 2011 Calumet Deploys Optical Interconnect Prototype LabFor Immediate Release CALUMET, MI: PCB Manufacturer - Calumet Electronics Corp. (Calumet) announces deployment of a new optical interconnect prototype lab at its production facility located in Calumet, Michigan, USA. Electronic operating systems have historically had a steadily increasing need for higher digital data transfer rates within on board components, circuit boards, and backplanes. These systems rely on increasingly complicated and time consuming measurement and data processing systems. Latencies associated with the speed at which the data can be transferred reduce the time available for the processing, and impose a limit on the overall system performance. Increasing the speed of these communications reduces these latencies, allowing more time for computation, which can often be equated with increasing the performance of the operating systems. The present state of the art interconnect systems utilize metal interconnects with limited data transmission capacity. Calumet continues its participation with Michigan Technological University of Houghton, MI, Dow Corning Corporation of Midland, MI, and Lockheed Martin in a joint research and development program funded by the Department of Defense – NAVY, to develop manufacturing capability to produce circuit boards with optical interconnections that provide data processing solutions. "The deployment of this facility will allow us to mature optical interconnect materials and manufacturing processes that will take this critical technology from our lab to our production floor" stated Stephen Marshall, National Sales Manager at Calumet. He also stated,"We look forward to providing a Made in the USA solution for this quantum shift in interconnection technology". About Calumet |
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