Mission-Critical Manufacturing™
Process Technology
Calumet has been making the difference in printed circuit boards for over 40 years. Mission-Critical Manufacturing is a total quality management method engineered to produce high reliability circuit boards and high performance relationships. Every board is made with pride in the security of our world-class facility. There is a difference!™
Registration
Today's circuit board registration requirements are measured by the mil. Higher density designs, surface mount features, and increased layer counts continue to test manufacturing capability. Calumet's advanced imaging, post-etch punching, and X-Ray drilling process technology performed in controlled environments result in a level of registration accuracy that lesser capabilities cannot produce.
Interconnect
Through hole interconnection provides functionality between circuit layers. The quality of the drilled hole barrel, the elimination of debris and epoxy residue, and a controlled electroless plating application are all key to the integrity of the interconnect. Calumet's Hitachi Drills, Pola & Massa surface preparation, and automated electroless plating with integrated Desmear provides better connections.
Plating
Additive plating defines the electrical, connective, and solderability characteristics of printed circuit boards. Plating composition, distribution, and thickness affect performance and service life. Calumet's menu driven, automated plating systems are optimized by continuous support of its Quality Assurance Lab. Optimized plating provides greater utility.
Soldermask
Soldermask defines the area requiring solderability. It also protects these surfaces from subsequent processes. Surface preparation and cleanliness, ink composition, deposition, imaging, and curing are key elements required to achieve target conditions. Calumet's LPI technology provides better soldermask solutions.
Conductivity
The integrity of the conductive patterns on circuit layers defines their functionality. The proximity of the pattern to specification impacts the level of function. Calumet's menu driven, conveyorized, chemical process lines are optimized by continuous support of its Quality Assurance Lab. Calumet's focus on the target condition assures maximum performance.
Multi-layers
Manufacturing high-performance, multilayered circuit boards begins with the selection of process capable materials. The lay up of the appropriate materials and a lamination process consisting of computerized, menu drive hot and cold press cycles results in consistent lamination throughout the board. Calumet's lamination technology provides highly reliable results.
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