smallest, lightest, fastest pcbs
enable next-gen electronics
go beyond subtractive processing
Dramatically increase in PCB circuit density with 1 mil (25µm) trace enabling high-density fanout with 0.4mm pitch BGA.
Improve RF performance over subtractive-etch processes. Improved SI with ratios greater than 1:1 for metal traces.
Dramatically decrease size and weight and increase density while improving reliability and reducing cost.
Current U.S. Capability
Current Asia Capability
new calumet capability
Limitations of U.S. Subtractive Processes
New capabilities at Calumet Electronics
3 mil (75µm) trace/space, trapezoidal traces
1 mil (25µm) trace/space, straight sidewalls
1.0mm BGAs, up to 4 fanout traces, 3 mil (75µm)
0.4mm BGAs, up to 6 fanout traces, 1 mil (25 µm)
mSAP 1µm/3.0µm base copper
A-SAP™ 0.25µm copper seed layer
Limited copper feature formation
High frequency passives, transmission lines, and waveguides