capabilities roadmap

Calumet Electronics has been manufacturing printed circuit boards in the USA since 1968. Over the years we have learned a lot about making boards and building partnerships. Mission-critical manufacturing maintains the process capability required to produce highly-reliable printed boards with dock-to-stock performance you can rely on. The following capability matrix is a snapshot of current, developing and planned process capabilities.

Feature
Standard
Advanced
Emerging
Attributes
Circuit Layers
1-24
24+
32+
Largest Panel Size
19.5″x22.5″
19.5″x22.5″
19.5″x22.5″
Laminate Materials
Minimum Thickness
.014″
.012″
.010″
Maximum Thickness
0.200″
0.280″
0.500″
Minimum Finished Core Thickness
.003″
.002″
<.002"
Copper Weight (Inner)
0.25-4oz Foil
0.25-5oz Foil
0.25-5oz Foil
Copper Weight (Outer)
0.25-3oz Foil
0.25-4oz Foil
0.25-4oz Foil
Copper Weight (Finished)
Up to 5oz Plated
Up to 5oz Plated
Up to 5oz Plated
FR4 Tg 140
Yes
Yes
Yes
FR4 Tg 170
Yes
Yes
Yes
Polymide
Yes
Yes
Yes
Rogers
Yes
Yes
Yes
Medium Loss: FR408 HR, -13EP
Yes
Yes
Yes
Low Loss: I-Tera, Megtron 6, Tachyon, Astra
Yes
Yes
Yes
RoHs Materials
Yes
Yes
Yes
Halogen Free
Yes
Yes
Yes
Duroid
No
Yes
Yes
Imaged Features
Internal Circuit Trace / Space
.003″/.003″
.002″/.002″
Sub 0.002″/0.002″
External Circuit Trace/Space
.0035″/.0035″
.003″/.003″
Sub 0.002″/0.002″
Minimum Pad
.004″
.0035″
.003″
SMT Pitch
.50mm
< .50mm
< .25mm
Controlled Impedance
10%
<10%
<5%
Drill (Via and PTH) Tolerances
Minimum Drilled Hole Thickness (Mechanical)
.0079″
.0059″
<.0059"
PTH Aspect Ratio
12:1
16:1
18:1
Backdrill
Yes
Yes
Yes
Via in Pad (non-conductive, epoxy)
Yes
Yes
Yes
Via in Pad (conductive fill)
Yes
Yes
Yes
Via in Pad – Copper Filled
Yes
Yes
Yes
Soldermask
Taiyo LPI
Green, Blue, Black
Red, Clear, Matte Green
Any Color
Taiyo DI LPI
Yes
Yes
Yes
Tented LPI
Coated with LPI
Coated/plugged
Coated/plugged
Dryfilm Soldermask
No
Yes
Yes
Minimum Clearance
.003″
.002″
< .002"
Minimum Web
.004″
.003″
< .003"
Surface Finishes
Tin/Lead Solder Finish
63/37 SnPb
63/37 SnPb
63/37 SnPb
Lead-Free Solder Finish
SN100C HASL
SN100C HASL
SN100C HASL
Immersion Gold Finish (ENIG)
per IPC-4552
per IPC-4552
per IPC-4552
Immersion Silver Finish
per IPC-4553 (Thick)
per IPC-4553 (Thick)
per IPC-4553 (Thick)
Gold Tabs
Yes
Yes
Yes
HDI Capabilites
Sequential Lamination
Yes (2 Lamination Cycles)
Yes (3 Lamination Cycles)
Yes (>3 Lamination Cycles)
Blind Vias
Yes
Yes
Yes
Micro Vias (Mechanical and Laser)
Yes
Yes
Yes
Blind Aspect Ratio
1:1
>1:1
>1.5:1
Milled Cavities
No
Yes
Yes
Backdrill Features
Yes
Yes
Yes
Test and Measurement
Flying Probe Test
Yes
Yes
Yes
Fixture Test (also double density)
Yes
Yes
Yes
Ionics
Yes
Yes
Yes
XRF
Yes
Yes
Yes
RF, Microwave, Beamforming
RF/Mixed Builds
Yes
Yes
Yes
Ormet Interconnects
No
Yes
Yes
Castellations / Plated edges
Yes
Yes
Yes
Buried Capacitance (Interra, Farad Flex)
No
Yes
Yes
Embedded Resistance: Tricer & Ohmega
Yes
Yes
Yes
Semi Additive Processing
Semi-Additive Trace (sub 25 micron)
No
Yes
Yes
Semi-Additive with PTH and microvias
No
Yes
Yes
Flex & Rigid Flex
Type 1: Single Sided Flex
No
Yes
Yes
Type 2: Double Sided Flex
No
Yes
Yes
Type 3: Multilayer Flex
No
No
Yes
Type 4: Multilayer Rigid Flex
No
No
Yes

Please contact us for further updates and/or specific interests.