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capabilities roadmap

Calumet Electronics has been manufacturing printed circuit boards in the USA since 1968. Over the years we have learned a lot about making boards and building partnerships. Mission-critical manufacturing maintains the process capability required to produce highly-reliable printed boards with dock-to-stock performance you can rely on. 

Feature
Standard
Advanced
Emerging
Attributes
Circuit Layers
40
40+
54+
Largest Panel Size
19.5″ x 22.5″
19.5″ x 22.5″
19.5″ x 22.5″
Laminate Materials
Minimum Thickness
.012″
.010″
.008″
Maximum Thickness
.200″
.280″
.500″
Minimum Finished Core Thickness
.002″
.0015″
< .0015"
Copper Weight (Inner)
.25 – 4oz Foil
3µm – 5oz Foil
3µm – 5oz Foil
Copper Weight (Outer)
.25 – 4oz Foil
.25 – 4oz Foil
.25 – 4oz Foil
Copper Weight (Finished)
Up to 5oz Plated
Up to 5oz Plated
Up to 5oz Plated
FR4 Tg 140
Yes
Yes
Yes
FR4 Tg 170
Yes
Yes
Yes
Polymide
Yes
Yes
Yes
Rogers
Yes
Yes
Yes
Medium Loss: FR408 HR, -13EP
Yes
Yes
Yes
Low Loss: I-Tera, Megtron 6, Tachyon, Astra
Yes
Yes
Yes
Ultra Low Loss: Megtron 7, Meterorwave
Yes
Yes
Yes
RoHs Materials
Yes
Yes
Yes
Halogen Free
Yes
Yes
Yes
Duroid
Yes
Yes
Yes
Imaged Features
Internal Circuit Trace / Space
.003″ / .003″
.002″ / .002″
Sub .002″ / .002″
External Circuit Trace / Space
.0035″ / .0035″
.003″ / .003″
Sub .002″ / .002″
Minimum Pad
.004″
.0035″
.003″
SMT Pitch
.50mm
< .50mm
< .25mm
Controlled Impedance
10%
< 10%
< 5%
Drill (Via and PTH) Tolerances
Minimum Drilled Hole Thickness (Mechanical)
.0059″
.0039″
< .0039"
PTH Aspect Ratio
12 : 1
16 : 1
18 : 1
Backdrill
Yes
Yes
Yes
Via in Pad (non-conductive, epoxy)
Yes
Yes
Yes
Via in Pad (conductive fill)
Yes
Yes
Yes
Via in Pad – Copper Filled
Yes
Yes
Yes
Soldermask
Direct-Image LPI – Colors
Green, Blue, Black
Red, Clear, Matte Green
Any Color
Tented LPI
Coated with LPI
Coated/plugged
Coated/plugged
Dryfilm Soldermask
No
Yes
Yes
Minimum Clearance
.003″
.002″
< .002"
Minimum Web
.004″
.003″
< .003"
Surface Finishes
Tin/Lead Solder Finish
63 / 37 SnPb HASL
63 / 37 SnPb HASL
63 / 37 SnPb HASL
Lead-Free Solder Finish
SN100C HASL
SN100C HASL
SN100C HASL
Immersion Gold Finish (ENIG)
per IPC-4552
per IPC-4552
per IPC-4552
Immersion Silver Finish
per IPC-4553 (Thick)
per IPC-4553 (Thick)
per IPC-4553 (Thick)
Gold Tabs
Yes
Yes
Yes
HDI Capabilites
Sequential Lamination
Yes (3 Lamination Cycles)
Yes (4 – 5 Lamination Cycles)
Yes (> 5 Lamination Cycles)
Blind Vias
Yes
Yes
Yes
Micro Vias (Mechanical and Laser)
Yes
Yes
Yes
Blind Aspect Ratio
1:1
> 1 : 1
> 1.5 : 1
Milled Cavities
Yes
Yes
Yes
Copper Plated Through Holes
Yes
Yes
Yes
Backdrill Features
Yes
Yes
Yes
Test and Measurement
Flying Probe Test
Yes
Yes
Yes
Fixture Test (also double density)
Yes
Yes
Yes
Ionics
Yes
Yes
Yes
XRF
Yes
Yes
Yes
OM D-Coupon Testing
Yes
Yes
Yes
Hi-Pot Testing
Yes
Yes
Yes
RF, Microwave, Beamforming
RF/Mixed Builds
Yes
Yes
Yes
Ormet Interconnects
Yes
Yes
Yes
Castellations / Plated edges
Yes
Yes
Yes
Buried Capacitance
Yes
Yes
Yes
Embedded Resistance
Yes
Yes
Yes
Semi Additive Processing
Semi-Additive Trace (sub 25 micron)
No
Yes
Yes
Semi-Additive with PTH and microvias
No
Yes
Yes
Microvia Diameter (on BUF)
NA
50µm
> 25µm
Build-Up Film (ABF)
No
Yes
Yes

You can view and download a copy of our capabilities statement here.

 

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I understand that, prior to being offered employment, I may be requested to take an employment examination. In the event I have a disability that will affect my ability to take the test, I will so inform the Company prior to the test so that a reasonable accommodation can be made. The Company reserves the right to require medical documentation regarding the need for accommodation.

Calumet Electronics Corporation participates in pre-employment drug testing.

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I certify that the facts contained in this application are true, accurate, and complete to the best of my knowledge, and understand that, if employed, falsified statements or omitted material facts on this application may result in my disqualification from consideration for employment, or termination from employment if I have been hired.

Calumet Electronics Corporation is an equal employment opportunity employer and will not discriminate against any applicant on the basis of any characteristic that is protected by State or Federal law.