capabilities roadmap

Calumet Electronics has been manufacturing printed circuit boards in the USA since 1968. Over the years we have learned a lot about making boards and building partnerships. Mission-critical manufacturing maintains the process capability required to produce highly-reliable printed boards with dock-to-stock performance you can rely on. The following capability matrix is a snapshot of current, developing and planned process capabilities.

  STANDARD ADVANCED EMERGING
Circuit Layers 1 – 20 22 + 32 +
Circuit Trace/Space 0.003″/0.003″ 0.002″/0.002″ <0.002″/0.002″
Minimum Thickness 0.014″ 0.014″ 0.014″
Minimum Finished Core Thickness 0.003″ 0.002″ 0.001″
Min Drilled Hole Thickness (Mechanical) 0.0079″ 0.0059″ 0.0059″
Blind Vias Yes Yes Yes
Microvias Yes Yes Yes
Microvia Aspect Ratio 1:1 > 1:1 > 1:1
Sequential Lamination / Buried Vias Yes (3-4 Lamination Cycles) Yes (> 4 Lamination Cycles) Yes (> 4 Lamination Cycles)
Copper Weight (Inner) 0.5-4oz Foil 0.5-5oz Foil 0.5-5oz Foil
Copper Weight (Outer) 0.25-3oz Foil 0.25-4oz Foil 0.25-4oz Foil
Copper Weight (Finished) Up to 5oz. Plated Up to 5oz. Plated Up to 5oz. Plated
Hole Aspect Ratio 14:1 16:1 18:1
BGA Pitch 0.0137″ / 0.35mm < 0.35mm < 0.35mm
Tin/Lead Solder Finish 63/37 SnPb HASL 63/37 SnPb HASL 63/37 SnPb HASL
Lead-Free Solder Finish SN100C HASL SN100C HASL SN100C HASL
Immersion Gold Finish per IPC-4552 per IPC-4552 per IPC-4552
Immersion Silver Finish per IPC-4553 (Thick) per IPC-4553 (Thick) per IPC-4553 (Thick)
Carbon Ink Yes Yes Yes
Controlled Impedance 10% < 10% < 10%
Largest Panel Size 19.5″ x 22.5″ 19.5″ x 22.5″ 19.5″ x 22.5″
Via Hole Plugging (Non-conductive) Yes Yes Yes
Via Hole Plugging (Conductive) Yes Yes Yes
Via Planarization / Via In Pad Yes Yes Yes
Castellations / Edge Plating Yes Yes Yes
RF / Mixed Builds Yes Yes Yes

 

Please contact us for further updates and/or specific interests.