Calumet Electronics is on-track to build one of America’s most advanced high-density interconnect (HDI)and High Density Buildup (HBDU) factories. Significant capital investments in equipment are being made and being brought online for the HDI capacity to be operational through 2025. New equipment began arriving at Calumet in September 2024, with deliveries continuing through Q1 and Q2 of 2025.
As one of America’s most reliable and innovative printed circuit board and substrate suppliers, Calumet Electronics Corporation is committed to advancing technologies that are critical to the nation’s aerospace, defense, and commercial markets. With growing demand for miniaturization and increased functionality, this equipment allows Calumet to offer a more compact design with high reliability, better signal integrity, and greater versatility, especially when weight and space are key considerations..
By accelerating domestic HDI and HBDU manufacturing technology, Calumet will boost production of more advanced products with greater precision. Calumet’s solely U.S. based production is available to support national security, intellectual property protection, and reduce the chance of supply chain delays.
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