Schmoll Combi 500 Laser Drill
Advanced microvia capacity and precision drilling to support next-generation HDI designs.
Combining high speed, material flexibility, and advanced registration, the Combi 500 delivers industry-leading microvia capacity and accuracy to support fine features and high-density PCB builds.
This drill expands the capacity that Calumet has for microvia processing in tandem with its other Schmoll Combi 350 laser drill.
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Increased capacity for laser drilling.
Higher microvia throughput supports
advanced HDI designs and improves
efficiency for complex builds. -
Dual CO₂ and UV laser platform.
Combines dielectric adaptability with
fine-feature precision for flexibility
across materials and stack-ups. -
Local registration for high-density drilling.
Ensures precise via-to-pad alignment for
fine pitch, stacked microvias, and
high layer-count designs.
- Increased capacity for laser drilling. Higher microvia throughput supports advanced HDI designs and improves efficiency for complex builds.
- Dual CO₂ and UV laser platform. Combines dielectric adaptability with fine-feature precision for flexibility across materials and stack-ups.
- Local registration for high-density drilling. Ensures precise via-to-pad alignment for fine pitch, stacked microvias, and high layer-count designs.
“As HDI designs push toward finer features and higher layer counts, microvia precision and capacity are critical. The Combi 500 allows us to scale complex builds while maintaining the registration accuracy our customers depend on.”
–Sean Binder,
National Sales Manager